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YUFENGREC®Oxide Bonded Silicon Carbide Plate /Setters mainly composed of silicon carbide, silicon micropowder, etc., and is formed and fired under high temperature in a shuttle kiln.
The product has excellent oxidation resistance, thermal shock stability, compact structure, high temperature volume stability, high temperature bending strength and other advantages.Meanwhile ,It can maximize the utilization rate of the kiln and the energy saving rate. In addition, it has good compactness, high temperature load, not easy to deform, not easy to slag, firm seam, and the alumina coating is not easy to fall off. Long life and reduced customer defect rate
* High Temperature Strength .
* Outstanding Thermal Shock Resistance.
* Excellent Thermal Conductivity.
* Heavy loading weight under high temperature applications.
* Electronic Industry
* Sanitary Ware Industry
* Making different shape of kiln furniture
Regular Size Available of Oxide Bonded Silicon Carbide Plate
Technical Data of Nitride Bonded Silicon Carbide Kiln Furniture
Item | Unit | Typical Index |
Physical Properties | ||
Max. Application Temperature | ºC | 1550 |
Refractoriness | SK | 39 |
Refractoriness Under Load 0.2 MPa | ºC | 1750 |
Bulk Density | g/cm3 | 2.70-2.75 |
Apparent Porosity | % | 7-8 |
Compression Strength | MPa | 130 |
Modulus of Rupture | MPa | 50 (Room Temp.) |
MPa | 50 (1400 ºC) | |
Thermal Conductivity at 1000 ºC | Kcal/m.hr.ºC | 13.5-14.5 |
Thermal Expansion at 1000 ºC | % | 0.42-0.48 |
Thermal Shock Resistance | Excellent | |
Chemical Composition | ||
SiC | % | 90 |
The data are average results of tests under standard procedures and are subject to variation. Results should not be used for specification purposes or creating any contractual obligation. For more information on the safety applications or materials ,please refer to the work practices and material safety data sheet
QC INSPECTION TO ASSURE OF EACH PRODUCTS ACCUTE SIZE
APPLICATIONS REFERERNCE
YUFENGREC®Oxide Bonded Silicon Carbide Plate /Setters mainly composed of silicon carbide, silicon micropowder, etc., and is formed and fired under high temperature in a shuttle kiln.
The product has excellent oxidation resistance, thermal shock stability, compact structure, high temperature volume stability, high temperature bending strength and other advantages.Meanwhile ,It can maximize the utilization rate of the kiln and the energy saving rate. In addition, it has good compactness, high temperature load, not easy to deform, not easy to slag, firm seam, and the alumina coating is not easy to fall off. Long life and reduced customer defect rate
* High Temperature Strength .
* Outstanding Thermal Shock Resistance.
* Excellent Thermal Conductivity.
* Heavy loading weight under high temperature applications.
* Electronic Industry
* Sanitary Ware Industry
* Making different shape of kiln furniture
Regular Size Available of Oxide Bonded Silicon Carbide Plate
Technical Data of Nitride Bonded Silicon Carbide Kiln Furniture
Item | Unit | Typical Index |
Physical Properties | ||
Max. Application Temperature | ºC | 1550 |
Refractoriness | SK | 39 |
Refractoriness Under Load 0.2 MPa | ºC | 1750 |
Bulk Density | g/cm3 | 2.70-2.75 |
Apparent Porosity | % | 7-8 |
Compression Strength | MPa | 130 |
Modulus of Rupture | MPa | 50 (Room Temp.) |
MPa | 50 (1400 ºC) | |
Thermal Conductivity at 1000 ºC | Kcal/m.hr.ºC | 13.5-14.5 |
Thermal Expansion at 1000 ºC | % | 0.42-0.48 |
Thermal Shock Resistance | Excellent | |
Chemical Composition | ||
SiC | % | 90 |
The data are average results of tests under standard procedures and are subject to variation. Results should not be used for specification purposes or creating any contractual obligation. For more information on the safety applications or materials ,please refer to the work practices and material safety data sheet
QC INSPECTION TO ASSURE OF EACH PRODUCTS ACCUTE SIZE
APPLICATIONS REFERERNCE